| Product Range | SIL PAD TSP Series |
|---|---|
| Thickness | 0.152 mm |
| Conductive Material | Boron Nitride Filled Silicone Elastomer |
| Thermal Conductivity | 1.1 W/m.K |
| Breakdown Voltage Vbr |
| 6 kV |
| Insulator Body Material | Silicone Elastomer |
|---|
| Thermal Impedance | 0.82 °C/W |
|---|
The SPK6-0.006-00-104 from Bergquist is a thermal pad, to3p. Key specifications include thickness of 0.152 mm, conductive material of Boron Nitride Filled Silicone Elastomer, product range of SIL PAD TSP Series, thermal conductivity of 1.1 W/m.K. CES Engineering supplies this part with volume pricing and a quotation within 24 hours. Submit a request with your quantity for current pricing and availability.
| Minimum Order Quantity | 10 |
|---|---|
| Order Multiple | 10 |
| Unit of Measure | Each |
| RoHS Compliant | Yes |
Unit price, USD. Excludes shipping and duties.
No payment required. Submit your list and we'll respond with a formal quote within 24 hours.
Prefer to email? info@ces-engineering.com
| Qty | Unit Price |
|---|---|
| 10+ | $0.3312 |
| 25+ | $0.3156 |
| 50+ | $0.3064 |
| 100+ | $0.3018 |
| 250+ | $0.2815 |
| 500+ | $0.2686 |
| 1000+ | $0.2594 |
Final pricing confirmed on quote.