| Product Range | SIL PAD TSP Series |
|---|---|
| Thickness | 0.15 mm |
| Conductive Material | Silicone |
| Thermal Conductivity | 1.3 W/m.K |
| Breakdown Voltage Vbr | 6 kV |
| Insulator Body Material | PI (Polyimide) Film |
|---|
| Volume Resistivity | 10 ohm-m |
|---|
The SIL PAD TSP K1300 from Bergquist is a thermal pad, to220. Key specifications include thickness of 0.15 mm, conductive material of Silicone, product range of SIL PAD TSP Series, volume resistivity of 10 ohm-m. CES Engineering supplies this part with volume pricing and a quotation within 24 hours. Submit a request with your quantity for current pricing and availability.
| Minimum Order Quantity | 1 |
|---|---|
| Order Multiple | 1 |
| Unit of Measure | Each |
| RoHS Compliant | Yes |
Unit price, USD. Excludes shipping and duties.
No payment required. Submit your list and we'll respond with a formal quote within 24 hours.
Prefer to email? info@ces-engineering.com
| Qty | Unit Price |
|---|---|
| 1+ | $0.8004 |
| 10+ | $0.7424 |
| 25+ | $0.6974 |
| 50+ | $0.6587 |
| 100+ | $0.5952 |
| 250+ | $0.5456 |
| 500+ | $0.4756 |
| 1000+ | $0.4269 |
Final pricing confirmed on quote.