LS-00018Breadboard, Solderless, 400 Tie Points, 2 Bus Strips, 81.28mm x 53.34mm

About the LS-00018

The LS-00018 from Osepp is a breadboard, solderless, 400 tie points, 2 bus strips, 81.28mm x 53.34mm. Key specifications include breadboard type of Solderless Breadboard, board material of Plastic, board type of Breadboard, external height of 3.2 ". CES Engineering supplies this part with volume pricing and a quotation within 24 hours. Submit a request with your quantity for current pricing and availability.

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